We devote substantial resources to the development of RF integrated circuits and multiple chip module technologies, which are regarded a new generation RF technologies. We believe that the trend in wireless communications is toward the use of higher frequency bandwidth and compact multi-functional individual wireless communication devices. In light of this trend, we are actively conducting research to explore possible ways to miniaturize our RF parts and components by using RF integrated circuits and multiple chip module technologies. RF integrated circuits products are integrated circuits that perform the same functions as RF parts and components. RF integrated circuits will be further integrated into multiple chip module components to produce new generation RF parts and components multiple chip module components are substantially more compact in size as compared to current forms of RF parts and components.

Basic thoughts of RF technologies:

• Four News are applied, i.e. New material, New technology, New instrument and New circuit.
• To realize the minimization and intellectualisation of wireless communication products by adopting RFIC and MCM
• GrenTech extends product series and realizes mass production according to our RF design standards in the aim of creating core technical competence, by using independent property rights in materials, instruments and techniques of RF products.